There are many people who contributed to Compart Systems from its formation in the mid 1990’s until today. These individuals and their contributions have made Compart Systems a growing technological leader with an established solid foundation and structure to make Compart Systems stronger, more effective and innovative today and for the years to come. It has been said you are only as good as the people working with you and it is the vision, passion, pride, taking ownership and working as a team which drives these individuals to go that extra step and push for success while living in the moment and preparing for the future.
Compart Systems’ leadership realized the Semiconductor industry gas and chemical delivery systems required specialized materials and products to ensure process purities and increased safety. Compart Systems realized this as a strong niche market requiring high-precision machining, specialized post processes and integrated new and innovative technology solutions. These coupled with stringent quality control give our customers the competitive advantages they require.
With the Semiconductor demands increasing to the highest levels of growth seen in decades and technologies driving for line widths below 10nm in the products used in their Wafer Fab Equipment (WFE), Compart Systems has made some significant investments. Compart Systems growth investments include additional high-precision CNC machines as well as additional capacity expansion in Electropolish and Welding (E-Beam, Laser, Orbital TIG Welding) within their Shenzhen China manufacturing facilities.
To assist our customers with achieving additional Korea content in their products and systems shipped to Samsung, Compart Systems opened an integration facility within 5km from the Samsung Wafer Fab complexes. This integration facility is focused on Weldments (Orbital and Manual TIG Welding) and MFC assembly and flow calibration for our strategic customers.
For the technology investments required to move the Semiconductor industry to sub 10nm geometries and new leading-edge materials, Compart Systems created TriClean® SEMI F20 UHP raw material. TriClean® material places Compart Systems into a very unique and competitive position with the Semiconductor Industry. When used in WFE Original Equipment Manufacturer (OEM) flow products, TriClean® increases the material corrosion resistivity and performance to the stringent purity and surface chemistry requirements at a cost below the existing material solutions.
Compart Systems continues to invest in developing or securing technologies and Intellectual Properties (IP) supporting the Semiconductor sub 10nm and Ultra High Purity (UHP) requirements. These IP investments coupled with our overall capabilities and capacity investments allows Compart Systems to better support our customers within the industries they serve.