TriClean® SEMI F20 UHP Raw Material
With the Semiconductor industry moving to sub 10nm geometries and new leading-edge materials and Semiconductor processes like 3D Nand and Atomic Layer Deposition (ALD), product cleanliness and corrosion resistivity has become the new challenge in flow control products and systems. In 2012 till 2014 Compart Systems working closely with our European Mill supplier, developed a better more homogenous corrosion resistant SEMI F20 UHP raw material for the Semiconductor industry. The investment made by both of us encompassed hundreds of man hours and came at a cost well over $1,000,000 dollars. This commitment and drive to develop this material was a great success and TriClean was developed. TriClean is a Triple Remelt SEMI F20 UHP raw material whose corrosion resistivity properties are greater than 2.5 to 11 times the industry standard SEMI F20 UHP material while lowering if not eliminating unwanted inclusions.
For our customers who are at the leading edge and providing flow control product solutions to the Semiconductor industry, TriClean is the solution to further increase the reliability and resistivity to corrosion gases used within Wafer Fab Equipment (WFE) Gas Systems. For more information please contact us.
The two (2) pictures shown above on the left are the results of performing Critical Pitting Temperature (CPT) testing on original SEMI F20 UHP raw material and the picture on the right is the CPT results of TriClean material. As you can see in the results above, TriClean not only performed better but the surface was still fully passive with no corrosion pits after running the CPT test.